Semiconductor Strategy: India’s NITI Aayog unveiled a 10-year roadmap aiming to build a $120–150B semiconductor value chain by 2035, with priorities in advanced packaging, compound semiconductors, wide-bandgap materials and AI-native chip design. Industrial Parks: India’s BHAVYA scheme is set to create “investment-ready” industrial parks, with DPIIT pushing states to submit investor-centric proposals that translate infrastructure into fast operational manufacturing. Food Manufacturing & Trade: India’s North East Food Manufacturing Summit in Guwahati focused on processing and packaging tech, plus market linkages via Indusfood/Indusfood Manufacturing in Jan 2027. Steel Import Substitution: Philippines steelmaker SteelAsia is commissioning a structural steel sections mill in Lemery, Batangas, using repatriated OFW technicians to replace imported I-beams and heavy shapes. Green Tech Pivot: Avi Polymers plans to move into green technology—waste management, advanced recycling, carbon-footprint optimization and sustainability consulting. EU Tech Sovereignty: The EU is preparing rules to reduce reliance on US cloud providers and Chinese chips, raising the stakes for transatlantic tech tensions. Modular Construction Deal: EcoModular signed a phased collaboration MoU with IDS and Modul Consult to scale modular building projects across the GCC. Supply Chain/Trade Risk: IATA reported global air cargo demand up 4% in April, but noted vulnerability to geopolitical shocks and higher fuel costs. Policy & Emissions: California CARB adopted updates to its Cap-and-Invest program, aiming to balance climate goals with affordability and jobs. Defense Manufacturing: Ohio’s Touchstone Advanced Composites is working with Northrop Grumman on composite molds for the YFQ-48A Talon Blue “loyal wingman” aircraft.